BGM13HBA9E6327XTSA1 - MULTI CHIP MODULES

Fabricant Nimewo Pati

BGM13HBA9E6327XTSA1

Entèn Nimewo Pati

AX-BGM13HBA9E6327XTSA1

Fabricant

Infineon Technologies

Kout Deskripsyon

MULTI CHIP MODULES

RoHS Ki dènye nouvèl

Plon gratis / RoHS Konfòm

akouchman Tan

1-2 jou

Disponib Kantite

1607330 Pieces

referans pri

~~USD 0.174552~~

pri nou

- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen BGM13HBA9E6327XTSA1 nan stock pou vann.

D 'opsyon ak anbake tan:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Posiblite peman:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Espesifikasyon pou BGM13HBA9E6327XTSA1

Kalite Garanti : 365 jou garanti

stock Resous : Franchize Distribitè / Fabricant Dirèk

PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nimewo pati : BGM13HBA9E6327XTSA1

Fabricant : Infineon Technologies

Deskripsyon : MULTI CHIP MODULES

Seri : -

Estati Pati : Active

RF Fanmi / Creole : Bluetooth

Pwotokòl : 802.11a/b/g/n, Bluetooth v4.0

Modilasyon : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM

Frekans : 1.805GHz ~ 2.69GHz

To Done : 54Mbps

Pouvwa - Sòti : -

Sansiblite : -

Interfaces seri : SPI, USB

Kalite Antèn : -

Itilize IC / Pati : -

Size memwa : -

Voltage - Pwovizyon pou : 1.6V ~ 3.1V

Kouran - Resevwa : -

Kouran - transmèt : -

Mounting Kalite : Surface Mount

Operating Tanperati : -40°C ~ 85°C

Pake / Ka : -

Pwa : -

kondisyon : Nouvo ak orijinal

Lyen ki gen rapò : BGM13H , BGM13HBA9

dokiman pou BGM13HBA9E6327XTSA1

Fich : BGM13HBA9E6327XTSA1.pdf

pwodwi ki gen rapò pou BGM13HBA9E6327XTSA1 Infineon Technologies

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