BGM13HBA9E6327XTSA1 Mode
Espesifikasyon pou BGM13HBA9E6327XTSA1
Nimewo pati : BGM13HBA9E6327XTSA1
Fabricant : Infineon Technologies
Deskripsyon : MULTI CHIP MODULES
Seri : -
Estati Pati : Active
RF Fanmi / Creole : Bluetooth
Pwotokòl : 802.11a/b/g/n, Bluetooth v4.0
Modilasyon : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Frekans : 1.805GHz ~ 2.69GHz
To Done : 54Mbps
Pouvwa - Sòti : -
Sansiblite : -
Interfaces seri : SPI, USB
Kalite Antèn : -
Itilize IC / Pati : -
Size memwa : -
Voltage - Pwovizyon pou : 1.6V ~ 3.1V
Kouran - Resevwa : -
Kouran - transmèt : -
Mounting Kalite : Surface Mount
Operating Tanperati : -40°C ~ 85°C
Pake / Ka : -
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
MULTI CHIP MODULES
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
1607330 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen BGM13HBA9E6327XTSA1 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou BGM13HBA9E6327XTSA1 Infineon Technologies
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 256MC 6.5NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Intel | IC CPLD 128MC 10NS 144TQFP | ||
| Intel | IC CPLD 128MC 10NS 100TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 256FTBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 256FBGA | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Intel | IC CPLD 64MC 4.5NS 100TQFP |