801-99-019-20-001000 - CONN RCP 19P 0.1 TIN-LEAD PCB RA

Fabricant Nimewo Pati

801-99-019-20-001000

Entèn Nimewo Pati

AX-801-99-019-20-001000

Fabricant

Mill-Max Manufacturing Corp.

Kout Deskripsyon

CONN RCP 19P 0.1 TIN-LEAD PCB RA

RoHS Ki dènye nouvèl

Plon gratis / RoHS Konfòm

akouchman Tan

1-2 jou

Disponib Kantite

38874 Pieces

referans pri

~~USD 8.6598~~

pri nou

- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen 801-99-019-20-001000 nan stock pou vann.

D 'opsyon ak anbake tan:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Posiblite peman:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Espesifikasyon pou 801-99-019-20-001000

Kalite Garanti : 365 jou garanti

stock Resous : Franchize Distribitè / Fabricant Dirèk

PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nimewo pati : 801-99-019-20-001000

Fabricant : Mill-Max Manufacturing Corp.

Deskripsyon : CONN RCP 19P 0.1 TIN-LEAD PCB RA

Seri : 801

Estati Pati : Active

Kalite Connector : Receptacle

Kontakte Kalite : Female Socket

Style : Board to Board

Kantite Pozisyon yo : 19

Kantite Pozisyon ki chaje : All

Pitch - kwazman : 0.100" (2.54mm)

Kantite ranje yo : 1

Ranje espas - kwazman : -

Mounting Kalite : Through Hole, Right Angle

Revokasyon : Solder

Kalite fiksasyon : Push-Pull

Kontakte Fini - Kwazman : Tin-Lead

Kontakte fini epesè - kwazman : 100.0µin (2.54µm)

Koulè izolasyon : Black

Wotasyon izolasyon : 0.100" (2.54mm)

Longè Kontakte - Post : 0.126" (3.20mm)

Operating Tanperati : -55°C ~ 125°C

Materyèl enflamabilite Rating : UL94 V-0

Kontakte Fini - Post : Tin-Lead

Konnen anpile Heights : -

Pwoteksyon Antre : -

Karakteristik : -

Kouran Rating : 4.5A

Rating Voltage : -

Pwa : -

kondisyon : Nouvo ak orijinal

Lyen ki gen rapò : 801-99 , 801-99-019

dokiman pou 801-99-019-20-001000

Fich : 801-99-019-20-001000.pdf

pwodwi ki gen rapò pou 801-99-019-20-001000 Mill-Max Manufacturing Corp.

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