TSM-107-01-L-DV-LC-006-P-TR - CONN HEADER SMD 14POS 2.54MM

Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN HEADER SMD 14POS 2.54MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
199825 Pieces
referans pri
USD 1.404
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen TSM-107-01-L-DV-LC-006-P-TR nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Espesifikasyon pou TSM-107-01-L-DV-LC-006-P-TR

Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati : TSM-107-01-L-DV-LC-006-P-TR
Fabricant : Samtec Inc.
Deskripsyon : CONN HEADER SMD 14POS 2.54MM
Seri : TSM
Estati Pati : Active
Kalite Connector : Header
Kontakte Kalite : Male Pin
Pitch - kwazman : 0.100" (2.54mm)
Kantite Pozisyon yo : 14
Kantite ranje yo : 2
Ranje espas - kwazman : 0.100" (2.54mm)
Kantite Pozisyon ki chaje : 13
Style : Board to Board or Cable
Dekorasyon : Unshrouded
Mounting Kalite : Surface Mount
Revokasyon : Solder
Kalite fiksasyon : Push-Pull
Longè kontak - kwazman : 0.230" (5.84mm)
Longè Kontakte - Post : -
Total Kontakte Length : -
Wotasyon izolasyon : 0.100" (2.54mm)
Kontakte fòm : Square
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 10.0µin (0.25µm)
Kontakte Fini - Post : Tin
Kontakte materyèl : Phosphor Bronze
Izolasyon Materyèl : Liquid Crystal Polymer (LCP)
Karakteristik : Board Lock, Pick and Place
Operating Tanperati : -55°C ~ 125°C
Pwoteksyon Antre : -
Materyèl enflamabilite Rating : UL94 V-0
Koulè izolasyon : Black
Kouran Rating : -
Rating Voltage : -
Pwa : -
kondisyon : Nouvo ak orijinal
Lyen ki gen rapò : TSM-107-0 , TSM-107-01-L-

dokiman pou TSM-107-01-L-DV-LC-006-P-TR

pwodwi ki gen rapò pou TSM-107-01-L-DV-LC-006-P-TR Samtec Inc.

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