CLP-114-02-L-D-BE-PA-TR - CONN RCPT 28POS 0.05 GOLD SMD

Fabricant Nimewo Pati

CLP-114-02-L-D-BE-PA-TR

Entèn Nimewo Pati

AX-CLP-114-02-L-D-BE-PA-TR

Fabricant

Samtec Inc.

Kout Deskripsyon

CONN RCPT 28POS 0.05 GOLD SMD

RoHS Ki dènye nouvèl

Plon gratis / RoHS Konfòm

akouchman Tan

1-2 jou

Disponib Kantite

110695 Pieces

referans pri

~~USD 2.5344~~

pri nou

- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen CLP-114-02-L-D-BE-PA-TR nan stock pou vann.

D 'opsyon ak anbake tan:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Posiblite peman:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Espesifikasyon pou CLP-114-02-L-D-BE-PA-TR

Kalite Garanti : 365 jou garanti

stock Resous : Franchize Distribitè / Fabricant Dirèk

PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nimewo pati : CLP-114-02-L-D-BE-PA-TR

Fabricant : Samtec Inc.

Deskripsyon : CONN RCPT 28POS 0.05 GOLD SMD

Seri : CLP

Estati Pati : Active

Kalite Connector : Receptacle, Bottom Entry

Kontakte Kalite : Female Socket

Style : Board to Board

Kantite Pozisyon yo : 28

Kantite Pozisyon ki chaje : All

Pitch - kwazman : 0.050" (1.27mm)

Kantite ranje yo : 2

Ranje espas - kwazman : 0.050" (1.27mm)

Mounting Kalite : Surface Mount

Revokasyon : Solder

Kalite fiksasyon : Push-Pull

Kontakte Fini - Kwazman : Gold

Kontakte fini epesè - kwazman : 10.0µin (0.25µm)

Koulè izolasyon : Black

Wotasyon izolasyon : 0.084" (2.14mm)

Longè Kontakte - Post : -

Operating Tanperati : -55°C ~ 125°C

Materyèl enflamabilite Rating : UL94 V-0

Kontakte Fini - Post : Tin

Konnen anpile Heights : -

Pwoteksyon Antre : -

Karakteristik : Pick and Place

Kouran Rating : 3.3A per Contact

Rating Voltage : 240VAC, 330VDC

Pwa : -

kondisyon : Nouvo ak orijinal

Lyen ki gen rapò : CLP-114 , CLP-114-02-

dokiman pou CLP-114-02-L-D-BE-PA-TR

Fich : CLP-114-02-L-D-BE-PA-TR.pdf

pwodwi ki gen rapò pou CLP-114-02-L-D-BE-PA-TR Samtec Inc.

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