HMTSW-102-09-T-S-561-RA-SPECIAL - CONN HEADER R/A 2POS 2.54MM

Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN HEADER R/A 2POS 2.54MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
1948360 Pieces
referans pri
USD 0.144
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen HMTSW-102-09-T-S-561-RA-SPECIAL nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Espesifikasyon pou HMTSW-102-09-T-S-561-RA-SPECIAL

Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati : HMTSW-102-09-T-S-561-RA-SPECIAL
Fabricant : Samtec Inc.
Deskripsyon : CONN HEADER R/A 2POS 2.54MM
Seri : Flex Stack, HMTSW
Estati Pati : Active
Kalite Connector : Header
Kontakte Kalite : Male Pin
Pitch - kwazman : 0.100" (2.54mm)
Kantite Pozisyon yo : 2
Kantite ranje yo : 1
Ranje espas - kwazman : -
Kantite Pozisyon ki chaje : All
Style : Board to Board or Cable
Dekorasyon : Unshrouded
Mounting Kalite : Through Hole, Right Angle
Revokasyon : Solder
Kalite fiksasyon : Push-Pull
Longè kontak - kwazman : 0.561" (14.25mm)
Longè Kontakte - Post : -
Total Kontakte Length : -
Wotasyon izolasyon : 0.119" (3.02mm)
Kontakte fòm : Square
Kontakte Fini - Kwazman : Tin
Kontakte fini epesè - kwazman : -
Kontakte Fini - Post : Tin
Kontakte materyèl : Phosphor Bronze
Izolasyon Materyèl : Liquid Crystal Polymer (LCP)
Karakteristik : -
Operating Tanperati : -55°C ~ 105°C
Pwoteksyon Antre : -
Materyèl enflamabilite Rating : UL94 V-0
Koulè izolasyon : Natural
Kouran Rating : 3A
Rating Voltage : -
Pwa : -
kondisyon : Nouvo ak orijinal
Lyen ki gen rapò : HMTSW-102- , HMTSW-102-09-T-

dokiman pou HMTSW-102-09-T-S-561-RA-SPECIAL

pwodwi ki gen rapò pou HMTSW-102-09-T-S-561-RA-SPECIAL Samtec Inc.

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