BDN13-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.31SQ

Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
HEATSINK CPU W/ADHESIVE 1.31SQ
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
142560 Pieces
referans pri
USD 1.968
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen BDN13-3CB/A01 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Espesifikasyon pou BDN13-3CB/A01

Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati : BDN13-3CB/A01
Fabricant : CTS Thermal Management Products
Deskripsyon : HEATSINK CPU W/ADHESIVE 1.31SQ
Seri : BDN
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman : Thermal Tape, Adhesive (Included)
Fòm : Square, Pin Fins
Longè : 1.310" (33.27mm)
Lajè : 1.310" (33.27mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 6.00°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 16.10°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Lyen ki gen rapò : BDN1 , BDN13-

dokiman pou BDN13-3CB/A01

pwodwi ki gen rapò pou BDN13-3CB/A01 CTS Thermal Management Products

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