BDN13-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.31SQ

Fabricant Nimewo Pati

BDN13-3CB/A01

Entèn Nimewo Pati

AX-BDN13-3CB/A01

Fabricant

CTS Thermal Management Products

Kout Deskripsyon

HEATSINK CPU W/ADHESIVE 1.31SQ

RoHS Ki dènye nouvèl

Plon gratis / RoHS Konfòm

akouchman Tan

1-2 jou

Disponib Kantite

142560 Pieces

referans pri

~~USD 1.968~~

pri nou

- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen BDN13-3CB/A01 nan stock pou vann.

D 'opsyon ak anbake tan:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Posiblite peman:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Espesifikasyon pou BDN13-3CB/A01

Kalite Garanti : 365 jou garanti

stock Resous : Franchize Distribitè / Fabricant Dirèk

PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Nimewo pati : BDN13-3CB/A01

Fabricant : CTS Thermal Management Products

Deskripsyon : HEATSINK CPU W/ADHESIVE 1.31SQ

Seri : BDN

Estati Pati : Active

Kalite : Top Mount

Pake refwadi : Assorted (BGA, LGA, CPU, ASIC...)

Metòd Atachman : Thermal Tape, Adhesive (Included)

Fòm : Square, Pin Fins

Longè : 1.310" (33.27mm)

Lajè : 1.310" (33.27mm)

Dyamèt : -

Wotè Off Sèvi (Tay nan Fin) : 0.355" (9.02mm)

Disipasyon pouvwa @ monte tanperati : -

Rezistans tèmik @ fòse Air koule : 6.00°C/W @ 400 LFM

Rezistans tèmik @ natirèl : 16.10°C/W

Materyèl : Aluminum

Materyèl Fini : Black Anodized

Pwa : -

kondisyon : Nouvo ak orijinal

Lyen ki gen rapò : BDN1 , BDN13-

dokiman pou BDN13-3CB/A01

Fich : BDN13-3CB/A01.pdf

pwodwi ki gen rapò pou BDN13-3CB/A01 CTS Thermal Management Products

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