FTSH-115-04-F-DH-C-TR - CONN HEADER SMD R/A 30POS 1.27MM

Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN HEADER SMD R/A 30POS 1.27MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
115165 Pieces
referans pri
USD 2.436
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen FTSH-115-04-F-DH-C-TR nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Espesifikasyon pou FTSH-115-04-F-DH-C-TR

Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati : FTSH-115-04-F-DH-C-TR
Fabricant : Samtec Inc.
Deskripsyon : CONN HEADER SMD R/A 30POS 1.27MM
Seri : FTSH
Estati Pati : Active
Kalite Connector : Header, Cuttable
Kontakte Kalite : Male Pin
Pitch - kwazman : 0.050" (1.27mm)
Kantite Pozisyon yo : 30
Kantite ranje yo : 2
Ranje espas - kwazman : 0.050" (1.27mm)
Kantite Pozisyon ki chaje : All
Style : Board to Board or Cable
Dekorasyon : Unshrouded
Mounting Kalite : Surface Mount, Right Angle
Revokasyon : Solder
Kalite fiksasyon : Push-Pull
Longè kontak - kwazman : 0.150" (3.81mm)
Longè Kontakte - Post : -
Total Kontakte Length : -
Wotasyon izolasyon : 0.135" (3.43mm)
Kontakte fòm : Square
Kontakte Fini - Kwazman : Gold
Kontakte fini epesè - kwazman : 3.00µin (0.076µm)
Kontakte Fini - Post : Tin
Kontakte materyèl : Phosphor Bronze
Izolasyon Materyèl : Liquid Crystal Polymer (LCP)
Karakteristik : Pick and Place
Operating Tanperati : -55°C ~ 125°C
Pwoteksyon Antre : -
Materyèl enflamabilite Rating : UL94 V-0
Koulè izolasyon : Black
Kouran Rating : 3.4A per Contact
Rating Voltage : -
Pwa : -
kondisyon : Nouvo ak orijinal
Lyen ki gen rapò : FTSH-11 , FTSH-115-0

dokiman pou FTSH-115-04-F-DH-C-TR

pwodwi ki gen rapò pou FTSH-115-04-F-DH-C-TR Samtec Inc.

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