HMTSW-106-23-L-S-230 - CONN HEADER VERT 6POS 2.54MM
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN HEADER VERT 6POS 2.54MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
658595 Pieces
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen HMTSW-106-23-L-S-230 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Espesifikasyon pou HMTSW-106-23-L-S-230
Kalite Garanti :
365 jou garanti
stock Resous :
Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati :
HMTSW-106-23-L-S-230
Fabricant :
Samtec Inc.
Deskripsyon :
CONN HEADER VERT 6POS 2.54MM
Seri :
Flex Stack, HMTSW
Estati Pati :
Active
Kalite Connector :
Header
Kontakte Kalite :
Male Pin
Pitch - kwazman :
0.100" (2.54mm)
Kantite Pozisyon yo :
6
Kantite ranje yo :
1
Ranje espas - kwazman :
-
Kantite Pozisyon ki chaje :
All
Style :
Board to Board or Cable
Dekorasyon :
Unshrouded
Mounting Kalite :
Through Hole
Revokasyon :
Solder
Kalite fiksasyon :
Push-Pull
Longè kontak - kwazman :
0.230" (5.84mm)
Longè Kontakte - Post :
0.115" (2.92mm)
Total Kontakte Length :
0.445" (11.30mm)
Wotasyon izolasyon :
0.100" (2.54mm)
Kontakte fòm :
Square
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte Fini - Post :
Tin
Kontakte materyèl :
Phosphor Bronze
Izolasyon Materyèl :
Liquid Crystal Polymer (LCP)
Karakteristik :
-
Operating Tanperati :
-55°C ~ 125°C
Pwoteksyon Antre :
-
Materyèl enflamabilite Rating :
UL94 V-0
Koulè izolasyon :
Natural
Kouran Rating :
3A
Rating Voltage :
-
Pwa :
-
kondisyon :
Nouvo ak orijinal
Lyen ki gen rapò :
HMTSW- , HMTSW-106-
dokiman pou HMTSW-106-23-L-S-230
Fich :
HMTSW-106-23-L-S-230.pdf
pwodwi ki gen rapò pou HMTSW-106-23-L-S-230 Samtec Inc.
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