S14B-ZESK-2D(T)(LF)(SN) - CONN HEADER R/A 14POS 1.5MM

Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
CONN HEADER R/A 14POS 1.5MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
479885 Pieces
referans pri
USD 0.58464
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen S14B-ZESK-2D(T)(LF)(SN) nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Espesifikasyon pou S14B-ZESK-2D(T)(LF)(SN)

Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati : S14B-ZESK-2D(T)(LF)(SN)
Fabricant : JST Sales America Inc.
Deskripsyon : CONN HEADER R/A 14POS 1.5MM
Seri : ZE
Estati Pati : Active
Kalite Connector : Header
Kontakte Kalite : Outer Shroud Contact
Pitch - kwazman : 0.059" (1.50mm)
Kantite Pozisyon yo : 14
Kantite ranje yo : 1
Ranje espas - kwazman : -
Kantite Pozisyon ki chaje : All
Style : Board to Cable/Wire
Dekorasyon : Shrouded - 4 Wall
Mounting Kalite : Through Hole, Right Angle
Revokasyon : Kinked Pin, Solder
Kalite fiksasyon : Locking Ramp
Longè kontak - kwazman : -
Longè Kontakte - Post : 0.134" (3.40mm)
Total Kontakte Length : -
Wotasyon izolasyon : 0.248" (6.30mm)
Kontakte fòm : Rectangular
Kontakte Fini - Kwazman : Tin
Kontakte fini epesè - kwazman : -
Kontakte Fini - Post : Tin
Kontakte materyèl : Copper Alloy
Izolasyon Materyèl : Polyamide (PA66), Nylon 6/6, Glass Filled
Karakteristik : Board Guide
Operating Tanperati : -25°C ~ 85°C
Pwoteksyon Antre : -
Materyèl enflamabilite Rating : UL94 V-0
Koulè izolasyon : Natural
Kouran Rating : 2A
Rating Voltage : 100V
Pwa : -
kondisyon : Nouvo ak orijinal
Lyen ki gen rapò : S14B-ZE , S14B-ZESK-2

dokiman pou S14B-ZESK-2D(T)(LF)(SN)

pwodwi ki gen rapò pou S14B-ZESK-2D(T)(LF)(SN) JST Sales America Inc.

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