TSM-109-01-L-SH-LC-001 - CONN HEADER SMD R/A 9POS 2.54MM
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN HEADER SMD R/A 9POS 2.54MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
197300 Pieces
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen TSM-109-01-L-SH-LC-001 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Espesifikasyon pou TSM-109-01-L-SH-LC-001
Kalite Garanti :
365 jou garanti
stock Resous :
Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati :
TSM-109-01-L-SH-LC-001
Fabricant :
Samtec Inc.
Deskripsyon :
CONN HEADER SMD R/A 9POS 2.54MM
Seri :
TSM
Estati Pati :
Active
Kalite Connector :
Header
Kontakte Kalite :
Male Pin
Pitch - kwazman :
0.100" (2.54mm)
Kantite Pozisyon yo :
9
Kantite ranje yo :
1
Ranje espas - kwazman :
-
Kantite Pozisyon ki chaje :
8
Style :
Board to Board or Cable
Dekorasyon :
Unshrouded
Mounting Kalite :
Surface Mount, Right Angle
Revokasyon :
Solder
Kalite fiksasyon :
Push-Pull
Longè kontak - kwazman :
0.230" (5.84mm)
Longè Kontakte - Post :
-
Total Kontakte Length :
-
Wotasyon izolasyon :
0.120" (3.05mm)
Kontakte fòm :
Square
Kontakte Fini - Kwazman :
Gold
Kontakte fini epesè - kwazman :
10.0µin (0.25µm)
Kontakte Fini - Post :
Tin
Kontakte materyèl :
Phosphor Bronze
Izolasyon Materyèl :
Liquid Crystal Polymer (LCP)
Karakteristik :
Board Lock
Operating Tanperati :
-55°C ~ 125°C
Pwoteksyon Antre :
-
Materyèl enflamabilite Rating :
UL94 V-0
Koulè izolasyon :
Black
Kouran Rating :
-
Rating Voltage :
-
Pwa :
-
kondisyon :
Nouvo ak orijinal
Lyen ki gen rapò :
TSM-109 , TSM-109-01-
dokiman pou TSM-109-01-L-SH-LC-001
Fich :
TSM-109-01-L-SH-LC-001.pdf
pwodwi ki gen rapò pou TSM-109-01-L-SH-LC-001 Samtec Inc.
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