B8B-ZR-SM4-TFT(LF)(SN) - CONN HEADER SMD 8POS 1.5MM
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN HEADER SMD 8POS 1.5MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
826170 Pieces
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen B8B-ZR-SM4-TFT(LF)(SN) nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Espesifikasyon pou B8B-ZR-SM4-TFT(LF)(SN)
Kalite Garanti :
365 jou garanti
stock Resous :
Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati :
B8B-ZR-SM4-TFT(LF)(SN)
Fabricant :
JST Sales America Inc.
Deskripsyon :
CONN HEADER SMD 8POS 1.5MM
Seri :
ZH
Estati Pati :
Active
Kalite Connector :
Header
Kontakte Kalite :
Male Pin
Pitch - kwazman :
0.059" (1.50mm)
Kantite Pozisyon yo :
8
Kantite ranje yo :
1
Ranje espas - kwazman :
-
Kantite Pozisyon ki chaje :
All
Style :
Board to Cable/Wire
Dekorasyon :
Shrouded - 4 Wall
Mounting Kalite :
Surface Mount
Revokasyon :
Solder
Kalite fiksasyon :
Detent Lock
Longè kontak - kwazman :
-
Longè Kontakte - Post :
-
Total Kontakte Length :
-
Wotasyon izolasyon :
0.197" (5.00mm)
Kontakte fòm :
Circular
Kontakte Fini - Kwazman :
Tin
Kontakte fini epesè - kwazman :
-
Kontakte Fini - Post :
Tin
Kontakte materyèl :
Brass
Izolasyon Materyèl :
Polyamide (PA6T), Nylon 6T, Glass Filled
Karakteristik :
Pick and Place, Solder Retention
Operating Tanperati :
-25°C ~ 85°C
Pwoteksyon Antre :
-
Materyèl enflamabilite Rating :
UL94 V-0
Koulè izolasyon :
Natural
Kouran Rating :
1A
Rating Voltage :
50V
Pwa :
-
kondisyon :
Nouvo ak orijinal
Lyen ki gen rapò :
B8B-ZR- , B8B-ZR-SM4-
dokiman pou B8B-ZR-SM4-TFT(LF)(SN)
Fich :
B8B-ZR-SM4-TFT(LF)(SN).pdf
pwodwi ki gen rapò pou B8B-ZR-SM4-TFT(LF)(SN) JST Sales America Inc.
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