BDN12-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.21SQ
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
HEATSINK CPU W/ADHESIVE 1.21SQ
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
175125 Pieces
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen BDN12-3CB/A01 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Espesifikasyon pou BDN12-3CB/A01
Kalite Garanti :
365 jou garanti
stock Resous :
Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Nimewo pati :
BDN12-3CB/A01
Fabricant :
CTS Thermal Management Products
Deskripsyon :
HEATSINK CPU W/ADHESIVE 1.21SQ
Seri :
BDN
Estati Pati :
Active
Kalite :
Top Mount
Pake refwadi :
Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman :
Thermal Tape, Adhesive (Included)
Fòm :
Square, Pin Fins
Longè :
1.210" (30.73mm)
Lajè :
1.210" (30.73mm)
Dyamèt :
-
Wotè Off Sèvi (Tay nan Fin) :
0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati :
-
Rezistans tèmik @ fòse Air koule :
6.80°C/W @ 400 LFM
Rezistans tèmik @ natirèl :
19.60°C/W
Materyèl :
Aluminum
Materyèl Fini :
Black Anodized
Pwa :
-
kondisyon :
Nouvo ak orijinal
dokiman pou BDN12-3CB/A01
Fich :
BDN12-3CB/A01.pdf
pwodwi ki gen rapò pou BDN12-3CB/A01 CTS Thermal Management Products
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