| Imaj | Nimewo pati | mak | Deskripsyon | kantite | Achte |
|---|---|---|---|---|---|
 | UMITEDCHEMI-CON | Package DIP UMITEDCHEMI-CON KLM160VS331M30X15T2 New original parts | 48066 pieces | ||
 | Samsung Semiconductor | eMMC 5.1 4 GB 1.8, 3.3 V / 3.3 V HS400 11 x 10 x 0.8 mm -25 ~ 85 °C Mass Production | 77410 pieces | ||
| Samsung Semiconductor | eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 114265 pieces | ||
| Samsung Semiconductor | eMMC 5.0 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 72000 pieces | ||
| Samsung Semiconductor | eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 78160 pieces | ||
| Samsung Semiconductor | eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 104520 pieces | ||
| Samsung Semiconductor | eMMC 5.1 8 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production | 86620 pieces | ||
| Samsung Semiconductor | eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 114900 pieces | ||
| Samsung Semiconductor | eMMC 5.1 8 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 113140 pieces | ||
| samsung | Package SMD or Through Hole samsung KLMA8DEDD-A101 KLMBG8EEGM-B001 KMAFE0000A-S998 New original part | 65515 pieces | ||
| Samsung Semiconductor | eMMC 5.1 16 GB 1.8, 3.3 V / 3.3 V HS400 11.5 x 13 x 0.8 mm -25 ~ 85 °C Mass Production | 85120 pieces | ||
| Samsung Semiconductor | eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 81465 pieces | ||
| Samsung Semiconductor | eMMC 5.0 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 81770 pieces | ||
| Samsung Semiconductor | eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 94115 pieces | ||
| Samsung Semiconductor | eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 89385 pieces | ||
| Samsung Semiconductor | eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 85 °C Mass Production | 94325 pieces | ||
| Samsung Semiconductor | eMMC 5.1 16 GB 1.8 / 3.3 V HS400 11.5 x 13 x 0.8 mm -40 ~ 105 °C Mass Production | 133175 pieces | ||
| SAMSUNG | Package BGAQFN SAMSUNG KLMAG4DEJE-A101 New original parts | 63025 pieces | ||
| SAMSUNG | Package BGA SAMSUNG KLMAG4EEHM-B101 New original parts | 10448 pieces | ||
| Samsung | Package SMD or Through Hole Samsung KLMAG4FE3B-A001 New original parts | 65515 pieces |
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