Imaj | Nimewo pati | mak | Deskripsyon | kantite | Achte |
---|---|---|---|---|---|
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOA-TCB New original parts |
41112 pieces |
|||
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOA-TCB-TCBO New original parts |
41106 pieces |
|||
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOA-TCB0 New original parts |
41112 pieces |
|||
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOA-TCB000 New original parts |
41112 pieces |
|||
SAMSUNG |
Package TSSOP SAMSUNG K9F4008WOA-TCBD New original parts |
33824 pieces |
|||
SAMSUNG |
Package SOP SAMSUNG K9F4008WOA-TI New original parts |
50982 pieces |
|||
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOA-TIB0 New original parts |
41106 pieces |
|||
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOA-TIBO New original parts |
41106 pieces |
|||
SAMSUNG |
Package TSOP SAMSUNG K9F4008WOACBO New original parts |
41112 pieces |
|||
SAM |
Package TSOP SAM K9F4008WUA-TCBO New original parts |
41556 pieces |
|||
SAMSUNG |
Package TSSOP SAMSUNG K9F408U0APCBOG New original parts |
33824 pieces |
|||
SAMSUNG |
Package TSSOP SAMSUNG K9F408UOAPCBOG New original parts |
33824 pieces |
|||
SAMSUNG |
Package SMD or Through Hole SAMSUNG K9F4G08U0A-PCBO New original parts |
65600 pieces |
|||
Samsung Semiconductor |
4 Gb x8 2.7 ~ 3.6 V 40 Mbps FBGA 63 -40 ~ 85 °C On-Chip ECC Sample |
114900 pieces |
|||
Samsung Semiconductor |
4 Gb x8 2.7 ~ 3.6 V 40 Mbps TSOP 48 -40 ~ 85 °C On-Chip ECC Sample |
75440 pieces |
|||
N/A |
Package TSOP N/A K9F4H08UOM New original parts |
41964 pieces |
|||
SAMSUNG |
Package SMD or Through Hole SAMSUNG K9F5608R0D-JIBO New original parts |
57910 pieces |
|||
SAMSUNG |
Package SMD or Through Hole SAMSUNG K9F5608U0A-YIB0 New original parts |
65600 pieces |
|||
SAMSUNG |
Package SMD or Through Hole SAMSUNG K9F5608U0C-DIBO New original parts |
65600 pieces |
|||
SAMSUNG |
Package SMD or Through Hole SAMSUNG K9F5608U0C-JIB0 New original parts |
65600 pieces |