Espesifikasyon pou THINC23-21.5-11.4-5.8-0.8
Nimewo pati : THINC23-21.5-11.4-5.8-0.8
Fabricant : t-Global Technology
Deskripsyon : THERM PAD 21.5X11.4MMX5.8MM GRAY
Seri : THINC
Estati Pati : Active
Itilizasyon : -
Kalite : Interface Cap
Fòm : Rectangular
Deskripsyon : 21.50mm x 11.40mm x 5.80mm
Pesè : 0.0315" (0.800mm)
Materyèl : Silicone
Adezif : -
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 1.9 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
THERM PAD 21.5X11.4MMX5.8MM GRAY
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
660920 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen THINC23-21.5-11.4-5.8-0.8 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou THINC23-21.5-11.4-5.8-0.8 t-Global Technology
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 7.1NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 384MC 5NS 256FTBGA | ||
| Intel | IC CPLD 256MC 7.5NS 100FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 32MC 5NS 48TQFP | ||
| Intel | IC CPLD 256MC 10NS 208QFP | ||
| Intel | IC CPLD 64MC 4.5NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 208QFP |