TGF60-07870787-059 Mode
Espesifikasyon pou TGF60-07870787-059
Nimewo pati : TGF60-07870787-059
Fabricant : Leader Tech Inc.
Deskripsyon : THERM PAD 199.9MMX199.9MM GRAY
Seri : TGF60
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 199.90mm x 199.90mm
Pesè : 0.0591" (1.500mm)
Materyèl : Aluminum Oxide filled Silicone
Adezif : -
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : 0.50°C/W
Konductivite tèmik : 6.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
THERM PAD 199.9MMX199.9MM GRAY
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
12344 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen TGF60-07870787-059 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou TGF60-07870787-059 Leader Tech Inc.
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 7NSNS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 324BGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 208QFP | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 208QFP | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Intel | IC CPLD 512MC 7.5NS 208QFP | ||
| Intel | IC CPLD 512MC 12NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 384MC 5NS 256FTBGA | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP |