SP600-25 Mode
Espesifikasyon pou SP600-25
Nimewo pati : SP600-25
Fabricant : Bergquist
Deskripsyon : THERM PAD 25.4MMX6.6MM GREEN
Seri : Sil-Pad® 600
Estati Pati : Active
Itilizasyon : DO-5
Kalite : Pad, Sheet
Fòm : Round
Deskripsyon : 25.40mm x 6.60mm
Pesè : 0.0090" (0.229mm)
Materyèl : Silicone Elastomer
Adezif : -
Fè bak, Carrier : -
Koulè : Green
Rezistivite tèmik : 0.35°C/W
Konductivite tèmik : 1.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-SP600-25
Fabricant
Kout Deskripsyon
THERM PAD 25.4MMX6.6MM GREEN
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
899240 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen SP600-25 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou SP600-25 Bergquist
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Microchip Technology | IC CPLD QTR PWR 25NS CER 44JLCC | ||
| Intel | IC CPLD 512MC 12NS 256FBGA | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 256BGA | ||
| Intel | IC CPLD 256MC 7.5NS 100FBGA | ||
| Intel | IC CPLD 128MC 7.5NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 7.5NS 352SBGA |