SP400-0.009-00-03 PDF Mode Download - THERM PAD 39.7MMX26.67MM GRAY

Nimewo pati : SP400-0.009-00-03

Fabricant : Bergquist

Deskripsyon : THERM PAD 39.7MMX26.67MM GRAY

Seri : Sil-Pad® 400

Estati Pati : Active

Itilizasyon : TO-3

Kalite : Pad, Sheet

Fòm : Rhombus

Deskripsyon : 39.70mm x 26.67mm

Pesè : 0.0090" (0.229mm)

Materyèl : Silicone Rubber

Adezif : -

Fè bak, Carrier : Fiberglass

Koulè : Gray

Rezistivite tèmik : 1.40°C/W

Konductivite tèmik : 0.9 W/m-K

Pwa : -

kondisyon : Nouvo ak orijinal

Kalite Garanti : 365 jou garanti

stock Resous : Franchize Distribitè / Fabricant Dirèk

PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Fabricant Nimewo Pati

Entèn Nimewo Pati

Fabricant

Kout Deskripsyon

THERM PAD 39.7MMX26.67MM GRAY

RoHS Ki dènye nouvèl

Plon gratis / RoHS Konfòm

akouchman Tan

1-2 jou

Disponib Kantite

1508405 moso

referans pri

~~USD 0~~

pri nou

- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen SP400-0.009-00-03 nan stock pou vann.

D 'opsyon ak anbake tan:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Posiblite peman:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Nimewo pati	mak	Deskripsyon
XCR3384XL-10PQ208I	Xilinx Inc.	IC CPLD 384MC 9NS 208QFP
XC2C384-10FG324I	Xilinx Inc.	IC CPLD 384MC 9.2NS 324FBGA
XCR3384XL-12TQ144C	Xilinx Inc.	IC CPLD 384MC 10.8NS 144QFP
XC2C512-10FTG256C	Xilinx Inc.	IC CPLD 512MC 9.2NS 256FBGA
XC2C512-7FT256C	Xilinx Inc.	IC CPLD 512MC 7.1NS 256BGA
EPM2210F324C4	Intel	IC CPLD 1700MC 7NS 324FBGA
M4A3-512/192-7FANC	Lattice Semiconductor Corporation	IC CPLD 512MC 7.5NS 256FBGA
ISPLSI 5256VE-125LB272	Lattice Semiconductor Corporation	IC CPLD 256MC 7.5NS 272BGA
EPM3064ATC44-7N	Intel	IC CPLD 64MC 7.5NS 44TQFP
XC2C512-10FG324C	Xilinx Inc.	IC CPLD 512MC 9.2NS 324BGA

SP400-0.009-00-03 Mode