RE-100-200-30 PDF Mode Download - THERMAL INTERFACE PAD GAP PAD

Nimewo pati : RE-100-200-30

Fabricant : Taica North America Corporation

Deskripsyon : THERMAL INTERFACE PAD GAP PAD

Seri : aGEL™ RE

Estati Pati : Active

Itilizasyon : -

Kalite : Gel Pad, Sheet

Fòm : Square

Deskripsyon : 200.00mm x 200.00mm

Pesè : 0.118" (3.00mm)

Materyèl : Silicone Gel

Adezif : Tacky - Both Sides

Fè bak, Carrier : -

Koulè : Black

Rezistivite tèmik : -

Konductivite tèmik : 2.0 W/m-K

Pwa : -

kondisyon : Nouvo ak orijinal

Kalite Garanti : 365 jou garanti

stock Resous : Franchize Distribitè / Fabricant Dirèk

PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Fabricant Nimewo Pati

Entèn Nimewo Pati

Fabricant

Kout Deskripsyon

THERMAL INTERFACE PAD GAP PAD

RoHS Ki dènye nouvèl

Plon gratis / RoHS Konfòm

akouchman Tan

1-2 jou

Disponib Kantite

7664 moso

referans pri

~~USD 0~~

pri nou

- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen RE-100-200-30 nan stock pou vann.

D 'opsyon ak anbake tan:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Posiblite peman:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Nimewo pati	mak	Deskripsyon
GAL16V8Z-15QJ	Lattice Semiconductor Corporation	IC CPLD 8MC 15NS 20PLCC
XC95144-7PQ160C	Xilinx Inc.	IC CPLD 144MC 7.5NS 160QFP
EPM7512AEQC208-7	Intel	IC CPLD 512MC 7.5NS 208QFP
EPM7256AEFI100-7N	Intel	IC CPLD 256MC 7.5NS 100FBGA
XCR3384XL-10FT256I	Xilinx Inc.	IC CPLD 384MC 9NS 256BGA
EPM7512AEQI208-10	Intel	IC CPLD 512MC 10NS 208QFP
EPM7512AEQC208-10	Intel	IC CPLD 512MC 10NS 208QFP
XCR3384XL-10TQG144I	Xilinx Inc.	IC CPLD 384MC 9NS 144QFP
M4A3-256/128-65YNC	Lattice Semiconductor Corporation	IC CPLD 256MC 6.5NS 208QFP
EPM2210GF324C3N	Intel	IC CPLD 1700MC 7NS 324FBGA

RE-100-200-30 Mode