Espesifikasyon pou L37-3F-15.1-11.5-0.3-1A
Nimewo pati : L37-3F-15.1-11.5-0.3-1A
Fabricant : t-Global Technology
Deskripsyon : THERM PAD 15.1MMX11.5MM W/ADH
Seri : L37-3F
Estati Pati : Active
Itilizasyon : -
Kalite : Conductive Pad, Sheet
Fòm : Rectangular
Deskripsyon : 15.10mm x 11.50mm
Pesè : 0.0120" (0.305mm)
Materyèl : Silicone Elastomer
Adezif : Adhesive - One Side
Fè bak, Carrier : -
Koulè : Yellow
Rezistivite tèmik : -
Konductivite tèmik : 1.4 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
THERM PAD 15.1MMX11.5MM W/ADH
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
5121655 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen L37-3F-15.1-11.5-0.3-1A nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou L37-3F-15.1-11.5-0.3-1A t-Global Technology
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|---|---|---|---|
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| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 256FTBGA | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 7NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324FBGA | ||
| Intel | IC CPLD 512MC 10NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA |