HSP-3 Mode
Espesifikasyon pou HSP-3
Nimewo pati : HSP-3
Fabricant : Sensata-Crydom
Deskripsyon : THERM PAD 104.39MMX73.66MM WHITE
Seri : HSP
Estati Pati : Active
Itilizasyon : Three Phase SSRs
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 104.39mm x 73.66mm
Pesè : 0.0039" (0.100mm)
Materyèl : -
Adezif : -
Fè bak, Carrier : -
Koulè : White
Rezistivite tèmik : -
Konductivite tèmik : 1.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-HSP-3
Fabricant
Kout Deskripsyon
THERM PAD 104.39MMX73.66MM WHITE
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
63015 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen HSP-3 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou HSP-3 Sensata-Crydom
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 256MC 6.5NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 324BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Xilinx Inc. | IC CPLD 384MC 7NS 144QFP | ||
| Intel | IC CPLD 512MC 10NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 256BGA | ||
| Intel | IC CPLD 64MC 10NS 100TQFP | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 208QFP | ||
| Microchip Technology | IC CPLD QTR PWR 25NS OTP 44PLCC |