HSC1003R9J Mode
Espesifikasyon pou HSC1003R9J
Nimewo pati : HSC1003R9J
Fabricant : TE Connectivity Passive Product
Deskripsyon : RES CHAS MNT 3.9 OHM 5 100W
Seri : HS, CGS
Estati Pati : Active
Rezistans : 3.9 Ohms
Tolerans : ±5%
Pouvwa (Watts) : 100W
Konpozisyon : Wirewound
Koefisyan Tanperati a : ±50ppm/°C
Operating Tanperati : -55°C ~ 200°C
Karakteristik : -
Kouch, Kalite Lojman : Aluminum
Mounting Feature : Flanges
Size / dimansyon : 2.579" L x 1.870" W (65.50mm x 47.50mm)
Wotè - chita (Max) : 1.024" (26.00mm)
Style plon : Solder Lugs
Pake / Ka : Axial, Box
Echèk To : -
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-HSC1003R9J
Fabricant
Kout Deskripsyon
RES CHAS MNT 3.9 OHM 5 100W
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
48408 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen HSC1003R9J nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou HSC1003R9J TE Connectivity Passive Product
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Microchip Technology | IC CPLD 24MC 20NS 44JLCC | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Intel | IC CPLD 512MC 5.5NS 256FBGA | ||
| Intel | IC CPLD 256MC 7.5NS 100TQFP | ||
| Intel | IC CPLD 512MC 7.5NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 7.5NS 352SBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 96MC 5.5NS 100TQFP |