Espesifikasyon pou HS27

Nimewo pati : HS27
Fabricant : Apex Microtechnology
Deskripsyon : HEATSINK 12P PWR SIP
Seri : Apex Precision Power®
Estati Pati : Active
Kalite : Board Level
Pake refwadi : PSIP
Metòd Atachman : Bolt On and PC Pin
Fòm : Rectangular, Fins
Longè : 3.000" (76.20mm)
Lajè : 2.360" (59.94mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.630" (16.00mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : -
Rezistans tèmik @ natirèl : 5.30°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-HS27
Kout Deskripsyon
HEATSINK 12P PWR SIP
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
20952 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen HS27 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
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pwodwi ki gen rapò pou HS27 Apex Microtechnology

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ISPLSI 5256VE-125LB272

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M4A3-32/32-10JC

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IC CPLD 32MC 10NS 44PLCC

EPM1270F256C3N

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XCR3512XL-12FT256C

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IC CPLD 512MC 10.8NS 256BGA

EPM2210GF256C3N

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IC CPLD 1700MC 7NS 256FBGA

EPM7128AETI100-7

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IC CPLD 128MC 7.5NS 100TQFP

XCR3384XL-12FTG256C

Xilinx Inc.

IC CPLD 384MC 10.8NS 256BGA