HS26 Mode
Espesifikasyon pou HS26
Nimewo pati : HS26
Fabricant : Apex Microtechnology
Deskripsyon : HEATSINK OPEN FRAME 0.5C/W
Seri : Apex Precision Power®
Estati Pati : Active
Kalite : Board Level, Extrusion
Pake refwadi : -
Metòd Atachman : Bolt On
Fòm : Rectangular, Fins
Longè : 9.000" (228.60mm)
Lajè : 6.620" (168.15mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.780" (45.21mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : -
Rezistans tèmik @ natirèl : 0.50°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-HS26
Fabricant
Kout Deskripsyon
HEATSINK OPEN FRAME 0.5C/W
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
9309 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen HS26 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou HS26 Apex Microtechnology
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Intel | IC CPLD 512MC 7.5NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA | ||
| Intel | IC CPLD 256MC 7.5NS 100FBGA | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP | ||
| Cypress Semiconductor Corp | IC CPLD 32MC 10NS 44LQFP | ||
| Intel | IC CPLD 512MC 10NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 7.5NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 3.5NS 176TQFP | ||
| Intel | IC CPLD 256MC 10NS 208QFP |