HS22 Mode
Espesifikasyon pou HS22
Nimewo pati : HS22
Fabricant : Apex Microtechnology
Deskripsyon : HEATSINK THERMALLOY 6025B
Seri : Apex Precision Power®
Estati Pati : Active
Kalite : Board Level, Vertical
Pake refwadi : TO-220
Metòd Atachman : Bolt On and PC Pin
Fòm : Rectangular, Fins
Longè : 1.250" (31.75mm)
Lajè : 0.875" (22.22mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.250" (6.35mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : -
Rezistans tèmik @ natirèl : 20.00°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-HS22
Fabricant
Kout Deskripsyon
HEATSINK THERMALLOY 6025B
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
38772 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen HS22 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou HS22 Apex Microtechnology
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 10.8NS 256BGA | ||
| Xilinx Inc. | IC CPLD 384MC 9.2NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 256BGA | ||
| Intel | IC CPLD 256MC 7.5NS 208QFP | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP | ||
| Intel | IC CPLD 128MC 7.5NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 32MC 5NS 48TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 64MC 15NS 44TQFP | ||
| Intel | IC CPLD 512MC 12NS 256FBGA |