HS03 Mode
Espesifikasyon pou HS03
Nimewo pati : HS03
Fabricant : Apex Microtechnology
Deskripsyon : HEATSINK 8P TO-3 1.7C/W
Seri : Apex Precision Power®
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On
Fòm : Rectangular, Fins
Longè : 3.000" (76.20mm)
Lajè : 4.750" (120.65mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.250" (31.75mm)
Disipasyon pouvwa @ monte tanperati : 15.0W @ 30°C
Rezistans tèmik @ fòse Air koule : 1.00°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 1.70°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-HS03
Fabricant
Kout Deskripsyon
HEATSINK 8P TO-3 1.7C/W
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
12152 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen HS03 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou HS03 Apex Microtechnology
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 324BGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 384MC 5NS 176TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 8MC 15NS 20PLCC | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 256BGA |