CIRBP18ECHSA Mode
Espesifikasyon pou CIRBP18ECHSA
Nimewo pati : CIRBP18ECHSA
Fabricant : TE Connectivity AMP Connectors
Deskripsyon : CONN BACKSHELL ADPT SZ18 BLK
Seri : CIRP
Estati Pati : Active
Kalite : Backshell, Heat Shrink Adapter
Ouvèti kab : -
Dyamèt - Deyò : 1.220" (30.99mm)
Kalite Shell - Antre : 18
Gwosè fil : 1-20 UNEF-2B
Kab sòti : 90°
Materyèl : Aluminum Alloy
PLATING : Zinc Cobalt
Pwoteksyon : Unshielded
Koulè : Black
Karakteristik : -
Pwoteksyon Antre : IP67 - Dust Tight, Waterproof
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-CIRBP18ECHSA
Fabricant
Kout Deskripsyon
CONN BACKSHELL ADPT SZ18 BLK
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
24213 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen CIRBP18ECHSA nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou CIRBP18ECHSA TE Connectivity AMP Connectors
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Intel | IC CPLD 512MC 10NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 208QFP | ||
| Intel | IC CPLD 256MC 7.5NS 100FBGA | ||
| Intel | IC CPLD 512MC 12NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 7NS 144QFP | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP |