BDN09-3CB Mode
Espesifikasyon pou BDN09-3CB
Nimewo pati : BDN09-3CB
Fabricant : CTS Thermal Management Products
Deskripsyon : HEATSINK CPU .91 SQ
Seri : BDN
Estati Pati : Active
Kalite : Top Mount
Pake refwadi : Assorted (BGA, LGA, CPU, ASIC...)
Metòd Atachman : Thermal Tape, Adhesive (Not Included)
Fòm : Square, Pin Fins
Longè : 0.910" (23.11mm)
Lajè : 0.910" (23.11mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.355" (9.02mm)
Disipasyon pouvwa @ monte tanperati : -
Rezistans tèmik @ fòse Air koule : 9.60°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 26.90°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-BDN09-3CB
Fabricant
Kout Deskripsyon
HEATSINK CPU .91 SQ
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
243540 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen BDN09-3CB nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou BDN09-3CB CTS Thermal Management Products
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 256FTBGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 208QFP | ||
| Intel | IC CPLD 64MC 4.5NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 324BGA | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 208QFP | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 256BGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 144QFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 256BGA |