AGC-09-A03N Mode
Espesifikasyon pou AGC-09-A03N
Nimewo pati : AGC-09-A03N
Fabricant : TE Connectivity Deutsch Connectors
Deskripsyon : CONN BACKSHELL SZ9 M18 BLACK
Seri : AG
Estati Pati : Active
Kalite : Backshell, Grounding
Ouvèti kab : -
Dyamèt - Deyò : 0.949" (24.10mm)
Kalite Shell - Antre : 9
Gwosè fil : M18x1
Kab sòti : 180°
Materyèl : Composite
PLATING : -
Pwoteksyon : Shielded
Koulè : Black
Karakteristik : -
Pwoteksyon Antre : -
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-AGC-09-A03N
Fabricant
Kout Deskripsyon
CONN BACKSHELL SZ9 M18 BLACK
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
15456 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen AGC-09-A03N nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou AGC-09-A03N TE Connectivity Deutsch Connectors
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Intel | IC CPLD 256MC 5.5NS 100TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324BGA | ||
| Intel | IC CPLD 256MC 7.5NS 144TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 7.5NS 256FTBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 256FTBGA | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Intel | IC CPLD 512MC 10NS 208QFP | ||
| Microchip Technology | IC CPLD 24MC 20NS 44JLCC |