Espesifikasyon pou A17752-16

Nimewo pati : A17752-16
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 228.6MMX228.6MM GRAY
Seri : Tflex™ HD90000
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 228.60mm x 228.60mm
Pesè : 0.160" (4.06mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 7.5 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
THERM PAD 228.6MMX228.6MM GRAY
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
9194 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen A17752-16 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou A17752-16 Laird Technologies - Thermal Materials

Nimewo pati mak Deskripsyon Achte

XCR3384XL-12TQG144C

Xilinx Inc.

IC CPLD 384MC 10.8NS 144QFP

XCR3384XL-10FTG256I

Xilinx Inc.

IC CPLD 384MC 9NS 256BGA

EPM7064AEFC100-4

Intel

IC CPLD 64MC 4.5NS 100FBGA

XCR3512XL-7PQ208C

Xilinx Inc.

IC CPLD 512MC 7NSNS 208QFP

M4A5-256/128-10YNI

Lattice Semiconductor Corporation

IC CPLD 256MC 10NS 208QFP

XCR3512XL-10PQ208C

Xilinx Inc.

IC CPLD 512MC 9NS 208QFP

EPM2210F324C3N

Intel

IC CPLD 1700MC 7NS 324FBGA

EPM3064ATC44-7N

Intel

IC CPLD 64MC 7.5NS 44TQFP

EPM7512AEQC208-12N

Intel

IC CPLD 512MC 12NS 208QFP

EPM7064STC100-10N

Intel

IC CPLD 64MC 10NS 100TQFP