Espesifikasyon pou A17751-20

Nimewo pati : A17751-20
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 457.2MMX457.2MM GRAY
Seri : Tflex™ HD90000
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 457.20mm x 457.20mm
Pesè : 0.200" (5.08mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 7.5 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
THERM PAD 457.2MMX457.2MM GRAY
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
8975 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen A17751-20 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou A17751-20 Laird Technologies - Thermal Materials

Nimewo pati mak Deskripsyon Achte

M4A5-192/96-6VC

Lattice Semiconductor Corporation

IC CPLD 192MC 6NS 144TQFP

XC2C512-10PQ208I

Xilinx Inc.

IC CPLD 512MC 9.2NS 208QFP

LC4512V-35TN176C

Lattice Semiconductor Corporation

IC CPLD 512MC 3.5NS 176TQFP

EPM7064AEFC100-4

Intel

IC CPLD 64MC 4.5NS 100FBGA

EPM7512AEQC208-7

Intel

IC CPLD 512MC 7.5NS 208QFP

XCR3384XL-10TQ144I

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

XCR3384XL-10FT256I

Xilinx Inc.

IC CPLD 384MC 9NS 256BGA

EPM9560RC240-15

Intel

IC CPLD 560MC 15NS 240RQFP

XC2C384-7PQG208C

Xilinx Inc.

IC CPLD 384MC 7.1NS 208QFP

EPM7512AEQI208-10N

Intel

IC CPLD 512MC 10NS 208QFP