Espesifikasyon pou A16366-23

Nimewo pati : A16366-23
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 431.8MMX457.2MM PINK
Seri : Tflex™ SF600 DF
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Rectangular
Deskripsyon : 431.80mm x 457.20mm
Pesè : 0.0230" (0.584mm)
Materyèl : Non-Silicone, Boron Nitride Filled
Adezif : Tacky - One Side
Fè bak, Carrier : -
Koulè : Pink
Rezistivite tèmik : -
Konductivite tèmik : 3.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
THERM PAD 431.8MMX457.2MM PINK
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
7016 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen A16366-23 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou A16366-23 Laird Technologies - Thermal Materials

Nimewo pati mak Deskripsyon Achte

GAL16V8Z-15QJ

Lattice Semiconductor Corporation

IC CPLD 8MC 15NS 20PLCC

M4A3-512/192-10FANI

Lattice Semiconductor Corporation

IC CPLD 512MC 10NS 256FBGA

EPM7512AEQC208-12

Intel

IC CPLD 512MC 12NS 208QFP

EPM7128STI100-10NG

Intel

IC CPLD 128MC 10NS 100TQFP

XCR3384XL-10PQG208I

Xilinx Inc.

IC CPLD 384MC 9NS 208QFP

EPM7256AEQC208-10N

Intel

IC CPLD 256MC 10NS 208QFP

XC2C512-7FGG324C

Xilinx Inc.

IC CPLD 512MC 7.1NS 324FBGA

EPM7128AETI144-7

Intel

IC CPLD 128MC 7.5NS 144TQFP

EPM1270F256C3N

Intel

IC CPLD 980MC 6.2NS 256FBGA

EPM7512AEFC256-10

Intel

IC CPLD 512MC 10NS 256FBGA