A16366-04 Mode
Espesifikasyon pou A16366-04
Nimewo pati : A16366-04
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 431.8MMX457.2MM PINK
Seri : Tflex™ SF600 DF
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Rectangular
Deskripsyon : 431.80mm x 457.20mm
Pesè : 0.0400" (1.016mm)
Materyèl : Non-Silicone, Boron Nitride Filled
Adezif : Tacky - One Side
Fè bak, Carrier : -
Koulè : Pink
Rezistivite tèmik : -
Konductivite tèmik : 3.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-A16366-04
Fabricant
Kout Deskripsyon
THERM PAD 431.8MMX457.2MM PINK
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
9347 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen A16366-04 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
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pwodwi ki gen rapò pou A16366-04 Laird Technologies - Thermal Materials
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Intel | IC CPLD 256MC 5.5NS 100FBGA | ||
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| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 256FTBGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 324BGA |