A16017-18 Mode
Espesifikasyon pou A16017-18
Nimewo pati : A16017-18
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 228.6MMX228.6MM GRAY
Seri : Tflex™ 200 V0
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 228.60mm x 228.60mm
Pesè : 0.180" (4.57mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - Both Sides
Fè bak, Carrier : -
Koulè : Gray
Rezistivite tèmik : -
Konductivite tèmik : 1.1 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-A16017-18
Fabricant
Kout Deskripsyon
THERM PAD 228.6MMX228.6MM GRAY
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
19464 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen A16017-18 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou A16017-18 Laird Technologies - Thermal Materials
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 384MC 7.1NS 324FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 176TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Xilinx Inc. | IC CPLD 384MC 9.2NS 324FBGA | ||
| Intel | IC CPLD 128MC 7.5NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 192MC 6NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324BGA | ||
| Intel | IC CPLD 128MC 5NS 100FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 3.5NS 256FTBGA |