Espesifikasyon pou A12616-19

Nimewo pati : A12616-19
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 228.6X228.6MM BLU/VIO
Seri : Tflex™ 600
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 228.60mm x 228.60mm
Pesè : 0.0200" (0.508mm)
Materyèl : Silicone Elastomer
Adezif : Tacky - One Side
Fè bak, Carrier : -
Koulè : Blue-Violet
Rezistivite tèmik : -
Konductivite tèmik : 3.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
THERM PAD 228.6X228.6MM BLU/VIO
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
18216 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen A12616-19 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou A12616-19 Laird Technologies - Thermal Materials

Nimewo pati mak Deskripsyon Achte

EPM3064ATC44-7N

Intel

IC CPLD 64MC 7.5NS 44TQFP

XC2C512-7FT256C

Xilinx Inc.

IC CPLD 512MC 7.1NS 256BGA

XCR3384XL-12TQG144I

Xilinx Inc.

IC CPLD 384MC 10.8NS 144QFP

LC4512V-5TN176C

Lattice Semiconductor Corporation

IC CPLD 512MC 5NS 176TQFP

EPM7512AEFC256-10N

Intel

IC CPLD 512MC 10NS 256FBGA

EPM2210F324C3N

Intel

IC CPLD 1700MC 7NS 324FBGA

XCR3512XL-12FT256I

Xilinx Inc.

IC CPLD 512MC 10.8NS 256BGA

EPM7256AEQC208-10

Intel

IC CPLD 256MC 10NS 208QFP

M4A3-256/128-65YNC

Lattice Semiconductor Corporation

IC CPLD 256MC 6.5NS 208QFP

EPM7256AETC144-7

Intel

IC CPLD 256MC 7.5NS 144TQFP