Espesifikasyon pou A10097-20

Nimewo pati : A10097-20
Fabricant : Laird Technologies - Thermal Materials
Deskripsyon : THERM PAD 406.4MMX406.4MM W/ADH
Seri : Tpli™ 200
Estati Pati : Active
Itilizasyon : -
Kalite : Gap Filler Pad, Sheet
Fòm : Square
Deskripsyon : 406.40mm x 406.40mm
Pesè : 0.0500" (1.270mm)
Materyèl : Silicone Elastomer
Adezif : Adhesive - One Side
Fè bak, Carrier : -
Koulè : Yellow
Rezistivite tèmik : -
Konductivite tèmik : 6.0 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
THERM PAD 406.4MMX406.4MM W/ADH
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
9162 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen A10097-20 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou A10097-20 Laird Technologies - Thermal Materials

Nimewo pati mak Deskripsyon Achte

EPM7512AEQI208-10

Intel

IC CPLD 512MC 10NS 208QFP

XCR3384XL-12PQ208I

Xilinx Inc.

IC CPLD 384MC 10.8NS 208QFP

XCR3512XL-12FTG256C

Xilinx Inc.

IC CPLD 512MC 10.8NS 256BGA

CY37032P44-125AXC

Cypress Semiconductor Corp

IC CPLD 32MC 10NS 44LQFP

XCR3512XL-10PQG208I

Xilinx Inc.

IC CPLD 512MC 9NS 208QFP

XCR3384XL-10TQ144C

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

XCR3384XL-10TQG144I

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

XC2C512-7FGG324C

Xilinx Inc.

IC CPLD 512MC 7.1NS 324FBGA

EPM7256AETI100-7N

Intel

IC CPLD 256MC 7.5NS 100TQFP

EPM7256AETC100-7

Intel

IC CPLD 256MC 7.5NS 100TQFP