Espesifikasyon pou 67SLG100100100PI00

Nimewo pati : 67SLG100100100PI00
Fabricant : Laird Technologies EMI
Deskripsyon : METAL FILM OVER FOAM CONTACTS
Seri : SMD Grounding Metallized
Estati Pati : Active
Kalite : Film Over Foam
Fòm : Rectangle
Lajè : 0.394" (10.00mm)
Longè : 0.394" (10.00mm)
Wotè : 0.394" (10.00mm)
Materyèl : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
PLATING : -
PLATING - Epesè : -
Metòd Atachman : Solder
Operating Tanperati : -40°C ~ 70°C
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
METAL FILM OVER FOAM CONTACTS
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
726995 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen 67SLG100100100PI00 nan stock pou vann.
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pwodwi ki gen rapò pou 67SLG100100100PI00 Laird Technologies EMI

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