67SLG030030050PI00 Mode
Espesifikasyon pou 67SLG030030050PI00
Nimewo pati : 67SLG030030050PI00
Fabricant : Laird Technologies EMI
Deskripsyon : METAL FILM OVER FOAM CONTACTS
Seri : SMD Grounding Metallized
Estati Pati : Active
Kalite : Film Over Foam
Fòm : Rectangle
Lajè : 0.118" (3.00mm)
Longè : 0.197" (5.00mm)
Wotè : 0.118" (3.00mm)
Materyèl : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
PLATING : -
PLATING - Epesè : -
Metòd Atachman : Solder
Operating Tanperati : -40°C ~ 70°C
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
METAL FILM OVER FOAM CONTACTS
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
3624015 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 67SLG030030050PI00 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 67SLG030030050PI00 Laird Technologies EMI
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| Xilinx Inc. | IC CPLD 512MC 9.2NS 256FTBGA | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 208QFP | ||
| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Intel | IC CPLD 256MC 7.5NS 100TQFP |