576802B03300G Mode
Espesifikasyon pou 576802B03300G
Nimewo pati : 576802B03300G
Fabricant : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : BOARD LEVEL HEAT SINK
Seri : -
Estati Pati : Active
Kalite : Board Level, Vertical
Pake refwadi : TO-220, TO-262
Metòd Atachman : Clip and PC Pin
Fòm : Rectangular, Fins
Longè : 0.748" (19.00mm)
Lajè : 0.500" (12.70mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.500" (12.70mm)
Disipasyon pouvwa @ monte tanperati : 1.0W @ 30°C
Rezistans tèmik @ fòse Air koule : 7.00°C/W @ 400 LFM
Rezistans tèmik @ natirèl : 27.30°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
BOARD LEVEL HEAT SINK
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
1109640 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 576802B03300G nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 576802B03300G Aavid, Thermal Division of Boyd Corporation
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 9.2NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324BGA | ||
| Intel | IC CPLD 64MC 10NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 256BGA | ||
| Intel | IC CPLD 256MC 7.5NS 100TQFP | ||
| Cypress Semiconductor Corp | IC CPLD 32MC 10NS 44LQFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA | ||
| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP |