Espesifikasyon pou 5570N-05

Nimewo pati : 5570N-05
Fabricant : 3M
Deskripsyon : THERM PAD GRY/WHT
Seri : 5570N
Estati Pati : Active
Itilizasyon : -
Kalite : Interface Pad, Roll
Fòm : Rectangular
Deskripsyon : -
Pesè : 0.0197" (0.500mm)
Materyèl : Acrylic Elastomer
Adezif : Tacky - One Side
Fè bak, Carrier : -
Koulè : Gray, White
Rezistivite tèmik : -
Konductivite tèmik : 1.3 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
THERM PAD GRY/WHT
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
9414 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen 5570N-05 nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou 5570N-05 3M

Nimewo pati mak Deskripsyon Achte

M4A5-192/96-6VC

Lattice Semiconductor Corporation

IC CPLD 192MC 6NS 144TQFP

EPM7256AETC144-7

Intel

IC CPLD 256MC 7.5NS 144TQFP

EPM7512AETC144-7

Intel

IC CPLD 512MC 7.5NS 144TQFP

M4A3-512/192-7FANC

Lattice Semiconductor Corporation

IC CPLD 512MC 7.5NS 256FBGA

XC2C512-10FTG256C

Xilinx Inc.

IC CPLD 512MC 9.2NS 256FBGA

EPM7512AEQC208-7

Intel

IC CPLD 512MC 7.5NS 208QFP

XC2C512-10FGG324I

Xilinx Inc.

IC CPLD 512MC 9.2NS 324FBGA

XCR3512XL-12PQG208I

Xilinx Inc.

IC CPLD 512MC 10.8NS 208QFP

XCR3512XL-12PQG208C

Xilinx Inc.

IC CPLD 512MC 10.8NS 208QFP

XCR3384XL-12TQ144C

Xilinx Inc.

IC CPLD 384MC 10.8NS 144QFP