Espesifikasyon pou 53-77-2ACG

Nimewo pati : 53-77-2ACG
Fabricant : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : THERM PAD 17.5X14.27MM W/ADH
Seri : Thermalsil™III
Estati Pati : Active
Itilizasyon : TO-220
Kalite : Pad, Sheet
Fòm : Rectangular
Deskripsyon : 17.50mm x 14.27mm
Pesè : 0.0060" (0.152mm)
Materyèl : Silicone Rubber
Adezif : Adhesive - One Side
Fè bak, Carrier : -
Koulè : Gray, Green
Rezistivite tèmik : -
Konductivite tèmik : 0.9 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
THERM PAD 17.5X14.27MM W/ADH
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
737310 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen 53-77-2ACG nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou 53-77-2ACG Aavid, Thermal Division of Boyd Corporation

Nimewo pati mak Deskripsyon Achte

EPM7512AETC144-10N

Intel

IC CPLD 512MC 10NS 144TQFP

EPM7512AETC144-12

Intel

IC CPLD 512MC 12NS 144TQFP

XCR3512XL-7PQ208C

Xilinx Inc.

IC CPLD 512MC 7NSNS 208QFP

XCR3384XL-12FT256I

Xilinx Inc.

IC CPLD 384MC 10.8NS 256BGA

XCR3512XL-10FT256C

Xilinx Inc.

IC CPLD 512MC 9NS 256BGA

XCR3512XL-10FGG324I

Xilinx Inc.

IC CPLD 512MC 9NS 324BGA

XC2C512-7FTG256C

Xilinx Inc.

IC CPLD 512MC 7.1NS 256BGA

XCR3384XL-10TQG144C

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

EPM7512AETC144-7N

Intel

IC CPLD 512MC 7.5NS 144TQFP

XCR3384XL-7PQG208C

Xilinx Inc.

IC CPLD 384MC 7NS 208QFP