53-03-16 Mode
Espesifikasyon pou 53-03-16
Nimewo pati : 53-03-16
Fabricant : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : THERM PAD 43.18X30.15MM GRY/GRN
Seri : Thermalsil™III
Estati Pati : Active
Itilizasyon : TO-3
Kalite : Pad, Sheet
Fòm : Rhombus
Deskripsyon : 43.18mm x 30.15mm
Pesè : 0.0060" (0.152mm)
Materyèl : Silicone Rubber
Adezif : -
Fè bak, Carrier : -
Koulè : Gray, Green
Rezistivite tèmik : -
Konductivite tèmik : 0.9 W/m-K
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-53-03-16
Kout Deskripsyon
THERM PAD 43.18X30.15MM GRY/GRN
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
680420 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 53-03-16 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 53-03-16 Aavid, Thermal Division of Boyd Corporation
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324BGA | ||
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| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 256BGA |