506003B01300 Mode
Espesifikasyon pou 506003B01300
Nimewo pati : 506003B01300
Fabricant : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : BOARD LEVEL HEAT SINK
Seri : -
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On and Board Mounts
Fòm : Rectangular, Fins
Longè : 2.000" (50.80mm)
Lajè : 1.750" (44.45mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 0.375" (9.52mm)
Disipasyon pouvwa @ monte tanperati : 16.0W @ 90°C
Rezistans tèmik @ fòse Air koule : 5.00°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 7.00°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
AX-506003B01300
Kout Deskripsyon
BOARD LEVEL HEAT SINK
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
233260 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 506003B01300 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 506003B01300 Aavid, Thermal Division of Boyd Corporation
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 384MC 7NS 256BGA | ||
| Intel | IC CPLD 64MC 15NS 100QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 192MC 6NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 9.2NS 324FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 32MC 5NS 48TQFP | ||
| Intel | IC CPLD 64MC 10NS 100TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 324BGA | ||
| Intel | IC CPLD 128MC 5NS 100FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 64MC 15NS 44TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA |