505403B00000G Mode
Espesifikasyon pou 505403B00000G
Nimewo pati : 505403B00000G
Fabricant : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEATSINK TO-3 H31.75MM
Seri : -
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On
Fòm : Square, Pin Fins
Longè : 1.780" (45.21mm)
Lajè : 1.780" (45.21mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.250" (31.75mm)
Disipasyon pouvwa @ monte tanperati : 7.0W @ 40°C
Rezistans tèmik @ fòse Air koule : 1.50°C/W @ 600 LFM
Rezistans tèmik @ natirèl : 6.00°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
HEATSINK TO-3 H31.75MM
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
241030 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 505403B00000G nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 505403B00000G Aavid, Thermal Division of Boyd Corporation
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|---|---|---|---|
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| Xilinx Inc. | IC CPLD 512MC 9.2NS 324BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 208QFP |