501603B00000G Mode
Espesifikasyon pou 501603B00000G
Nimewo pati : 501603B00000G
Fabricant : Aavid, Thermal Division of Boyd Corporation
Deskripsyon : HEAT SINK TO-3 1.25 COMPACT
Seri : -
Estati Pati : Active
Kalite : Board Level
Pake refwadi : TO-3
Metòd Atachman : Bolt On
Fòm : Rhombus
Longè : 1.880" (47.75mm)
Lajè : 1.400" (35.56mm)
Dyamèt : -
Wotè Off Sèvi (Tay nan Fin) : 1.250" (31.75mm)
Disipasyon pouvwa @ monte tanperati : 4.0W @ 30°C
Rezistans tèmik @ fòse Air koule : 3.00°C/W @ 200 LFM
Rezistans tèmik @ natirèl : 7.80°C/W
Materyèl : Aluminum
Materyèl Fini : Black Anodized
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
HEAT SINK TO-3 1.25 COMPACT
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
359690 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 501603B00000G nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 501603B00000G Aavid, Thermal Division of Boyd Corporation
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 384MC 7.1NS 208QFP | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 208QFP | ||
| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 208QFP | ||
| Intel | IC CPLD 512MC 12NS 144TQFP | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 256FBGA |