225M316-19C-V Mode
Espesifikasyon pou 225M316-19C-V
Nimewo pati : 225M316-19C-V
Fabricant : TE Connectivity AMP Connectors
Deskripsyon : CONN BACKSHELL ADPT SZ 16 SLVR
Seri : 225M3
Estati Pati : Active
Kalite : Backshell, Heat Shrink Adapter
Ouvèti kab : -
Dyamèt - Deyò : 1.051" (26.70mm)
Kalite Shell - Antre : 16, 16S
Gwosè fil : 7/8-20 UNEF
Kab sòti : 180°
Materyèl : Aluminum Alloy
PLATING : Electroless Nickel
Pwoteksyon : Unshielded
Koulè : Silver
Karakteristik : -
Pwoteksyon Antre : -
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN BACKSHELL ADPT SZ 16 SLVR
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
10208 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 225M316-19C-V nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 225M316-19C-V TE Connectivity AMP Connectors
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 512MC 7.5NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 144MC 7.5NS 160QFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 324BGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 208QFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 324FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 256FTBGA | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Intel | IC CPLD 64MC 15NS 100QFP | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 208QFP | ||
| Intel | IC CPLD 512MC 12NS 208QFP |