208M914-19B03 Mode
Espesifikasyon pou 208M914-19B03
Nimewo pati : 208M914-19B03
Fabricant : TE Connectivity AMP Connectors
Deskripsyon : CONN BACKSHELL ADPT SZ 15D OLIVE
Seri : 208M9
Estati Pati : Active
Kalite : Backshell, Heat Shrink Adapter
Ouvèti kab : -
Dyamèt - Deyò : 1.142" (29.00mm)
Kalite Shell - Antre : 15, D
Gwosè fil : M22x1
Kab sòti : 90°
Materyèl : Aluminum Alloy
PLATING : Cadmium
Pwoteksyon : Shielded
Koulè : Olive Drab
Karakteristik : Termination Ring
Pwoteksyon Antre : Environment Resistant
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN BACKSHELL ADPT SZ 15D OLIVE
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
7240 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 208M914-19B03 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 208M914-19B03 TE Connectivity AMP Connectors
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 512MC 3.5NS 256FTBGA | ||
| Intel | IC CPLD 512MC 10NS 144TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 384MC 3.5NS 176TQFP | ||
| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 32MC 10NS 44PLCC | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 7.5NS 176TQFP | ||
| Intel | IC CPLD 512MC 12NS 144TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 208QFP |