203M016-19B08 Mode
Espesifikasyon pou 203M016-19B08
Nimewo pati : 203M016-19B08
Fabricant : TE Connectivity AMP Connectors
Deskripsyon : CONN BACKSHELL ADPT SZ 16 16S 19
Seri : 203M0
Estati Pati : Active
Kalite : Backshell, Heat Shrink Adapter
Ouvèti kab : -
Dyamèt - Deyò : 1.110" (28.19mm)
Kalite Shell - Antre : 16, 16S, 19
Gwosè fil : 1-20 UNEF
Kab sòti : 180°
Materyèl : Aluminum Alloy
PLATING : Cadmium
Pwoteksyon : Shielded
Koulè : Olive Drab
Karakteristik : Termination Ring
Pwoteksyon Antre : -
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Fabricant
Kout Deskripsyon
CONN BACKSHELL ADPT SZ 16 16S 19
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
11688 moso
referans pri
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])
- AXE Semiconductor gen 203M016-19B08 nan stock pou vann.
- D 'opsyon ak anbake tan:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Posiblite peman:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
pwodwi ki gen rapò pou 203M016-19B08 TE Connectivity AMP Connectors
| Nimewo pati | mak | Deskripsyon | Achte |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 64MC 15NS 44TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 384MC 3.5NS 256FTBGA | ||
| Intel | IC CPLD 512MC 7.5NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 144QFP | ||
| Intel | IC CPLD 512MC 7.5NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 208QFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 7NSNS 256BGA |