Espesifikasyon pou 202M318-19H

Nimewo pati : 202M318-19H
Fabricant : TE Connectivity AMP Connectors
Deskripsyon : CONN BACKSHELL ADPT SZ 18-F GOLD
Seri : 202M3
Estati Pati : Active
Kalite : Backshell, Heat Shrink Adapter
Ouvèti kab : -
Dyamèt - Deyò : 1.475" (37.47mm)
Kalite Shell - Antre : 18, F
Gwosè fil : 1 1/8-28 UN
Kab sòti : 180°
Materyèl : Aluminum Alloy
PLATING : Cadmium
Pwoteksyon : Unshielded
Koulè : Gold
Karakteristik : -
Pwoteksyon Antre : -
Pwa : -
kondisyon : Nouvo ak orijinal
Kalite Garanti : 365 jou garanti
stock Resous : Franchize Distribitè / Fabricant Dirèk
PEYI KOTE L SOTI : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Fabricant Nimewo Pati
Entèn Nimewo Pati
Kout Deskripsyon
CONN BACKSHELL ADPT SZ 18-F GOLD
RoHS Ki dènye nouvèl
Plon gratis / RoHS Konfòm
akouchman Tan
1-2 jou
Disponib Kantite
19536 moso
referans pri
USD 0
pri nou
- (Tanpri kontakte nou pou yon pri pi bon: [email protected])

AXE Semiconductor gen 202M318-19H nan stock pou vann.
D 'opsyon ak anbake tan:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Posiblite peman:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

pwodwi ki gen rapò pou 202M318-19H TE Connectivity AMP Connectors

Nimewo pati mak Deskripsyon Achte

M5LV-384/120-15YI

Lattice Semiconductor Corporation

IC CPLD 384MC 15NS 160QFP

EPM7128AETI144-7N

Intel

IC CPLD 128MC 7.5NS 144TQFP

EPM7128AEFI100-7

Intel

IC CPLD 128MC 7.5NS 100FBGA

EPM7256AETI144-7

Intel

IC CPLD 256MC 7.5NS 144TQFP

XCR3384XL-10FTG256C

Xilinx Inc.

IC CPLD 384MC 9NS 256BGA

EPM2210F324C4

Intel

IC CPLD 1700MC 7NS 324FBGA

EPM2210GF324I5

Intel

IC CPLD 1700MC 7NS 324FBGA

XCR3384XL-10FT256I

Xilinx Inc.

IC CPLD 384MC 9NS 256BGA

ATV2500BQ-25JC

Microchip Technology

IC CPLD QTR PWR 25NS OTP 44PLCC

EPM7128AETI100-7

Intel

IC CPLD 128MC 7.5NS 100TQFP